Jobs / Ast***
Technical Lead Package Platform Engineer
Ast*** · San Jose, CA, United States
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San Jose, CA, United States160,000-200,000 USD/yearlyOnsite
Remuneration
160,000-200,000 USD/yearly
Location
San Jose, CA, United States
Visa sponsorship
Sponsors visa
Job summary
Ast*** is seeking a Lead Package Engineer to oversee the development, qualification, and manufacturing of advanced FCBGA packages, managing technical execution, supplier relationships, and project management.
Benefits
Discretionary bonusIncentivesBenefits
Qualifications
- Strong experience in FCBGA assembly manufacturing processes
- Proven NPI development experience for advanced flip-chip packages
- Experience with package implementation from die netlist to design
- Demonstrated experience managing substrate suppliers and assembly partners
- Strong technical project management skills
- Ability to lead and collaborate across teams
- Experience managing customer returns and field quality issues
- Strong problem-solving skills
Responsibilities
- Lead FCBGA package NPI development from concept to production release
- Provide technical leadership in FCBGA assembly manufacturing processes
- Manage technical execution with substrate suppliers and assembly OSAT partners
- Lead technical project management activities
- Collaborate with internal teams for successful product development
- Lead package reliability assessment and qualification planning
- Support system-level reliability assessment for large-size FCBGA packages
- Investigate and resolve customer returns and field quality issues
- Drive root cause analysis and corrective actions
- Support package and substrate warpage characterization and improvement
- Contribute expertise to advanced packaging technologies
Relocation
No